Invention Grant
- Patent Title: Resin composition for sealing electrical electronic parts, method of producing electrical electronic parts, and sealed electrical electronic parts
-
Application No.: US14424146Application Date: 2013-08-20
-
Publication No.: US10005901B2Publication Date: 2018-06-26
- Inventor: Yosuke Watanabe , Kenji Shiga
- Applicant: TOYOBO CO., LTD.
- Applicant Address: JP Osaka
- Assignee: TOYOBO CO., LTD.
- Current Assignee: TOYOBO CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2012-189009 20120829; JP2012-189010 20120829
- International Application: PCT/JP2013/072166 WO 20130820
- International Announcement: WO2014/034474 WO 20140306
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L67/02 ; B29C45/14 ; H01L23/31 ; C08L67/04 ; H01L23/29 ; C08L23/00 ; B29K23/00 ; B29K63/00 ; B29K67/00 ; B29L31/34 ; C08K5/521
Abstract:
Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D).
Public/Granted literature
Information query
