Invention Grant
- Patent Title: Resin composition
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Application No.: US14899332Application Date: 2014-06-24
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Publication No.: US10005937B2Publication Date: 2018-06-26
- Inventor: Masakazu Kandori , Yohei Hashimoto , Hiroshi Kishida , Rikiya Yamashita
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-131369 20130624
- International Application: PCT/JP2014/066616 WO 20140624
- International Announcement: WO2014/208518 WO 20141231
- Main IPC: C09J175/16
- IPC: C09J175/16 ; C08L63/00 ; C08G18/67 ; C08G18/81 ; H01M2/02

Abstract:
A resin composition capable of securely adhering multiple members in a short time without having to establish a long aging process. The resin composition including: (1) a urethane (meth)acrylate; (2) at least one selected from a group of (meth)acrylates having a phosphate group, (meth)acrylic silane coupling agents, and (meth)acrylates having an isocyanate group; and (3) a (meth)acrylate having an epoxy group.
Public/Granted literature
- US20160145477A1 RESIN COMPOSITION Public/Granted day:2016-05-26
Information query
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