Invention Grant
- Patent Title: Thermosensitive adhesive
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Application No.: US14783333Application Date: 2014-04-24
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Publication No.: US10005938B2Publication Date: 2018-06-26
- Inventor: Minoru Nanchi , Koji Yamashita , Ayumi Nagao , Shinichiro Kawahara
- Applicant: NITTA CORPORATION
- Applicant Address: JP Osaka
- Assignee: Nitta Corporation
- Current Assignee: Nitta Corporation
- Current Assignee Address: JP Osaka
- Agency: Volpe and Koenig, P.C.
- Priority: JP2013-110197 20130524
- International Application: PCT/JP2014/061516 WO 20140424
- International Announcement: WO2014/188840 WO 20141127
- Main IPC: C09J193/04
- IPC: C09J193/04 ; C09J133/16 ; C09J133/08 ; C09J7/35 ; C09J133/02 ; C09D133/16 ; C08F220/18 ; C08K5/07 ; C08K5/00

Abstract:
A thermosensitive adhesive contains a side chain crystal polymer having a melting point of 20-30° C., and a tackifier. The side chain crystal polymer is obtainable by adding a metal chelate compound in the following amount of addition (A) into the following copolymer, followed by a crosslinking reaction. Adhesive strength is to be deteriorated at a temperature below the melting point. The copolymer is obtainable by polymerizing 25-30 parts by weight of (meth)acrylate having a straight-chain alkyl group having 16 to 22 carbon atoms, 60-65 parts by weight of (meth)acrylate having an alkyl group having 1 to 6 carbon atoms, 1-10 parts by weight of a polar monomer, and 1-10 parts by weight of a reactive fluorine compound. The amount of addition (A) is 3-10 parts by weight with respect to 100 parts by weight of a copolymer.
Public/Granted literature
- US20160068727A1 THERMOSENSITIVE ADHESIVE Public/Granted day:2016-03-10
Information query
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