Invention Grant
- Patent Title: Power supplying member and high-speed plating machine provided with the same
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Application No.: US14897186Application Date: 2014-06-06
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Publication No.: US10006143B2Publication Date: 2018-06-26
- Inventor: Yoshitaka Mochizuki , Toshihisa Miyazaki , Akira Takamatsu
- Applicant: KYB CORPORATION
- Applicant Address: JP Minato-Ku, Tokyo
- Assignee: KYB CORPORATION
- Current Assignee: KYB CORPORATION
- Current Assignee Address: JP Minato-Ku, Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2013-125556 20130614
- International Application: PCT/JP2014/065050 WO 20140606
- International Announcement: WO2014/199908 WO 20141218
- Main IPC: C25D17/12
- IPC: C25D17/12 ; C25D5/08 ; C25D17/00 ; C25D17/10 ; C25D21/10 ; C25D7/00 ; C25D17/06

Abstract:
Providing a power-supplying member capable of desirably performing plating for a long period of time. A second power-supplying member is brought into contact with an article to be plated to apply negative voltage to the article. The article is disposed in a state such that a space in which a plating solution flows is defined between an anode and the article. The second power-supplying member includes a center member made from copper and a covering member made from titanium and covering at least a part of a periphery of the center member. The part is wetted with the plating solution.
Public/Granted literature
- US20160108540A1 POWER-SUPPLYING MEMBER AND HIGH-SPEED PLATING MACHINE PROVIDED WITH THE SAME Public/Granted day:2016-04-21
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