Invention Grant
- Patent Title: Adaptive baking system and method of using the same
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Application No.: US14200214Application Date: 2014-03-07
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Publication No.: US10006717B2Publication Date: 2018-06-26
- Inventor: Tzung-Chen Wu , Wen-Zhan Zhou , Heng-Jen Lee , Ho-Yung David Hwang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: F27D19/00
- IPC: F27D19/00 ; H01L21/67 ; F27B17/00

Abstract:
An adaptive baking system includes a baking chamber configured to receive a wafer, and a heating element configured to support the wafer. The adaptive baking system further includes a controller configured to receive temperature information related to the heating element and the wafer, wherein the controller is further configured to adjust an amount of heat provided by the heating element during a baking process in response to the temperature information.
Public/Granted literature
- US20150253083A1 ADAPTIVE BAKING SYSTEM AND METHOD OF USING THE SAME Public/Granted day:2015-09-10
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