Invention Grant
- Patent Title: Positive resist composition and patterning process
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Application No.: US14803547Application Date: 2015-07-20
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Publication No.: US10007178B2Publication Date: 2018-06-26
- Inventor: Jun Hatakeyama , Masaki Ohashi , Masahiro Fukushima
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2014-164387 20140812
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; G03F7/32

Abstract:
A positive resist composition is provided comprising a polymer having an acid labile group and an acid generator bound to its backbone, in admixture with an onium salt having a specific cation structure capable of generating sulfonic acid having a molecular weight of at least 540. The composition is effective for suppressing acid diffusion, has high resolution, and forms a pattern of satisfactory profile and minimal edge roughness after exposure and development.
Public/Granted literature
- US20160048076A1 POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS Public/Granted day:2016-02-18
Information query
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