Invention Grant
- Patent Title: Electrostatic puck assembly with metal bonded backing plate for high temperature processes
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Application No.: US14830389Application Date: 2015-08-19
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Publication No.: US10008399B2Publication Date: 2018-06-26
- Inventor: Vijay D. Parkhe
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H05B3/68
- IPC: H05B3/68 ; H01L21/67 ; H01J37/32 ; H01L21/683 ; H01L21/687
Abstract:
An electrostatic puck assembly includes an upper puck plate, a lower puck plate and a backing plate. The upper puck plate comprises AlN or Al2O3 and has a first coefficient of thermal expansion. The lower puck plate comprises a material having a second coefficient of thermal expansion that approximately matches the first coefficient of thermal expansion and is bonded to the upper puck plate by a first metal bond. The backing plate comprises AlN or Al2O3 and is bonded to the lower puck plate by a second metal bond.
Public/Granted literature
- US20160343600A1 ELECTROSTATIC PUCK ASSEMBLY WITH METAL BONDED BACKING PLATE FOR HIGH TEMPERATURE PROCESSES Public/Granted day:2016-11-24
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