Invention Grant
- Patent Title: Semiconductor package and method of forming the same
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Application No.: US15299525Application Date: 2016-10-21
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Publication No.: US10008460B2Publication Date: 2018-06-26
- Inventor: An-Jhih Su , Hsien-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L21/56 ; H01L25/065 ; H01L25/10 ; H01L25/00 ; H01L23/498 ; H01L23/31 ; H01L21/3105 ; H01L25/16 ; H01L23/50 ; H01L21/48 ; H01L23/538
Abstract:
According to an exemplary embodiment, a semiconductor package is provided. The semiconductor package includes: a chip having a plurality of joint pads; a component having a plurality of metal caps on one side and having a grinded surface on the other side, wherein the metal caps are in contact with the joint pads of the chip.
Public/Granted literature
- US20170040271A1 Semiconductor Package and Method of Forming the Same Public/Granted day:2017-02-09
Information query
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