Invention Grant
- Patent Title: Semiconductor structure having a patterned surface structure and semiconductor chips including such structures
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Application No.: US14731426Application Date: 2015-06-05
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Publication No.: US10008461B2Publication Date: 2018-06-26
- Inventor: Shing-Yih Shih , Tieh-Chiang Wu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00
Abstract:
A connector structure and a manufacturing method thereof are provided. The connector structure includes a semiconductor substrate, a metal layer, a passivation layer, and a conductive structure. The metal layer is over the semiconductor substrate. The passivation layer is over the metal layer and includes an opening. The conductive structure is in contact with the metal layer in a patterned surface structure of the conductive structure through the opening of the passivation layer.
Public/Granted literature
- US20160358868A1 CONNECTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-12-08
Information query
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