Invention Grant
- Patent Title: Semiconductor module adapted to be inserted into connector of external device
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Application No.: US15489031Application Date: 2017-04-17
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Publication No.: US10008488B2Publication Date: 2018-06-26
- Inventor: Yongkwan Lee , Kundae Yeom , Jongho Lee , Hogeon Song
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Inc.
- Current Assignee: Samsung Electronics Co., Inc.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0048377 20160420
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L21/48 ; H01L23/00 ; H01L23/498 ; H01L23/538 ; H01L25/065 ; H01L25/10
Abstract:
In one embodiment, the semiconductor module includes a module substrate and a first substrate mounted on and electrically connected to a first surface of the module substrate. The first substrate has one or more first electrical connectors of the semiconductor module, and the first substrate electrically connecting the first electrical connector to the module substrate.
Public/Granted literature
- US20170309606A1 MODULE SUBSTRATE AND SEMICONDUCTOR MODULE Public/Granted day:2017-10-26
Information query
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