A memory device which stores a large amount of data is provided. The memory device includes a first transistor, a second transistor, a third transistor, a first capacitor, a second capacitor, and first to third wirings. The first transistor includes an oxide semiconductor in a channel formation region, the second transistor includes silicon in a channel formation region, and the third transistor includes silicon in a channel formation region. The first capacitor is provided in the same layer as the first transistor. A region of the second capacitor and a region of the first capacitor overlap with each other. The thickness of a dielectric of the second capacitor is preferably larger than the thickness of a dielectric of the first capacitor.