Invention Grant
- Patent Title: Metal FinFET anti-fuse
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Application No.: US15099199Application Date: 2016-04-14
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Publication No.: US10008507B2Publication Date: 2018-06-26
- Inventor: Praneet Adusumilli , Alexander Reznicek , Oscar van der Straten , Miaomiao Wang , Chih-Chao Yang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L27/112 ; H01L29/66

Abstract:
Semiconductor structures containing FinFET anti-fuses with reduced breakdown voltage are provided which can be readily integrated with high performance FinFETs. The anti-fuse includes at least one metal structure having a faceted sidewall. The sharp corner of the faceted sidewall of the at least one metal structure causes an electric field concentration, thus reducing the breakdown voltage of the anti-fuse.
Public/Granted literature
- US20170301680A1 METAL FINFET ANTI-FUSE Public/Granted day:2017-10-19
Information query
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