Invention Grant
- Patent Title: Semiconductor structure and method of forming the same
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Application No.: US14948046Application Date: 2015-11-20
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Publication No.: US10008538B2Publication Date: 2018-06-26
- Inventor: Harry-Hak-Lay Chuang , Kuei-Hung Shen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L27/22
- IPC: H01L27/22 ; H01L43/02 ; H01L43/08 ; H01L43/12

Abstract:
The present disclosure provides a semiconductor structure, including a logic region and a memory region adjacent to the logic region. The memory region includes a Nth metal layer, a bottom electrode over the Nth metal layer, a magnetic tunneling junction (MTJ) layer over the bottom electrode, a top electrode over the MTJ layer, and a (N+1)th metal layer over the top electrode. The top electrode includes material having an oxidation rate lower than that of Tantalum or Tantalum derivatives. N is an integer greater than or equal to 1.
Public/Granted literature
- US20170148849A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2017-05-25
Information query
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