Invention Grant
- Patent Title: Method and system of flattening a surface formed by sealant of packaging cover plate, and packaging method
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Application No.: US14743472Application Date: 2015-06-18
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Publication No.: US10008690B2Publication Date: 2018-06-26
- Inventor: Zhiliang Jiang , Minghua Xuan , Renrong Gai , Bo Zhang , Fei Chen
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , Ordos Yuansheng Optoelectronics Co., Ltd.
- Applicant Address: CN Beijing CN Ordos, Inner Mongolia
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Current Assignee Address: CN Beijing CN Ordos, Inner Mongolia
- Agency: Kinney & Lange, P.A.
- Priority: CN201510052001 20150130
- Main IPC: C03C25/68
- IPC: C03C25/68 ; H01L51/52 ; H01L21/428 ; H01L21/02 ; H01L21/449
Abstract:
The present invention discloses a method and a system of flattening a surface formed by sealant of a packaging cover plate, as well as a packaging method, the method includes vibrating a high temperature sintered packaging cover plate by using a high frequency vibrator with a preset frequency, and irradiating the surface formed by sealant of the packaging cover plate by using a laser with preset power, so that a convex portion formed by the sealant is melted and flows to a concave portion formed by the sealant under vibration of the high frequency vibrator, thereby flattening the surface formed by sealant of the packaging cover plate.
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