An organic light emitting diode package structure includes a first structure layer, a second structure layer, and a luminous layer disposed between the first structure layer and the second structure layer. Two recesses are formed by bending two respective opposite ends of the first structure layer. End sections of the second structure layer and the luminous layer are located in the two recesses. One of the first structure layer and the second structure layer is a substrate base layer, and the other is a package layer. An area of a display panel is thus increased.