Invention Grant
- Patent Title: High-frequency module
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Application No.: US15394868Application Date: 2016-12-30
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Publication No.: US10008757B2Publication Date: 2018-06-26
- Inventor: Kunitoshi Hanaoka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-142121 20140710
- Main IPC: H01P1/00
- IPC: H01P1/00 ; H01P5/18 ; H03H7/38 ; H04B1/04 ; H05K1/02 ; H05K1/11 ; H05K1/18 ; H02M1/00

Abstract:
An inductor component is disposed outside a multilayer substrate, and thus a directional coupler defined by an internal wiring electrode and a coil electrode within the inductor component that is mounted on a pair of land electrodes, the multilayer substrate significantly reduces or prevents interference with other high-frequency circuit elements disposed in or on the multilayer substrate. Additionally, if a plurality of inductor components having different inductor characteristics are prepared, a high-frequency module including the multilayer substrate capable of defining the directional coupler whose characteristics are able to adjusted with ease is able to be provided simply by selecting the desired inductor component from the inductor components and replacing that inductor component.
Public/Granted literature
- US20170110779A1 HIGH-FREQUENCY MODULE Public/Granted day:2017-04-20
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