Invention Grant
- Patent Title: Metal-clad laminate and printed wiring board
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Application No.: US14126837Application Date: 2012-06-12
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Publication No.: US10009997B2Publication Date: 2018-06-26
- Inventor: Hiroharu Inoue , Koji Kishino
- Applicant: Hiroharu Inoue , Koji Kishino
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-134899 20110617
- International Application: PCT/JP2012/003811 WO 20120612
- International Announcement: WO2012/172776 WO 20121220
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/09 ; B32B7/02 ; B32B17/10 ; H05K1/03 ; B32B15/08 ; B32B27/08 ; B32B27/20 ; B32B27/26 ; H05K3/02

Abstract:
A metal-clad laminate according to the invention is provided with an insulating layer and a metal layer present on at least one surface side of the insulating layer. The insulating layer is formed by laminating at least two layers, which are a first resin layer and a second resin layer disposed between the first resin layer and the metal layer. The first resin layer and the second resin layer each include a cured product of a resin composition. The resin composition in the first resin layer is different from the resin composition in the second resin layer. A relative permittivity of the cured product of the resin composition included in the second resin layer is lower than a relative permittivity of the cured product of the resin composition included in the first resin layer.
Public/Granted literature
- US20140116764A1 METAL-CLAD LAMINATE AND PRINTED WIRING BOARD Public/Granted day:2014-05-01
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