Invention Grant
- Patent Title: Electronic control device and method of manufacturing electronic control device
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Application No.: US13972321Application Date: 2013-08-21
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Publication No.: US10010006B2Publication Date: 2018-06-26
- Inventor: Takaaki Tanaka , Hisakazu Yamane
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Agent Richard C. Turner
- Priority: JP2013-059948 20130322
- Main IPC: H05K5/06
- IPC: H05K5/06 ; H01R12/58 ; H05K5/00 ; H01R12/70 ; H01R13/66

Abstract:
Provided is an electronic control device, in which positioning of a case including a connector housing portion and a pin header portion of a connector mounted on an electronic circuit board may be carried out easily with high accuracy so that ease of assembly and a water-proof property of the connector are improved. The electronic control device includes: an electronic circuit board (1) on which a pin header (30) used for electric connection to an external device is mounted together with an electronic component (11); and a case (2) for receiving the electronic circuit board therein, the case including a connector housing portion (31) provided as an opening portion (310) at a position corresponding to the pin header. A cover (20) of the case including the connector housing portion and the pin header mounted on the electronic circuit board have a first positioning structure using press-fit.
Public/Granted literature
- US20140285985A1 ELECTRONIC CONTROL DEVICE AND METHOD OF MANUFACTURING ELECTRONIC CONTROL DEVICE Public/Granted day:2014-09-25
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