Invention Grant
- Patent Title: Absorbing layer for blister package, laminate comprising same, and blister package using said laminate
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Application No.: US15319557Application Date: 2015-06-18
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Publication No.: US10010480B2Publication Date: 2018-07-03
- Inventor: Masayuki Hosoi , Kazumi Arai , Midori Kato , Makoto Kato
- Applicant: Kyodo Printing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Kyodo Printing Co., Ltd.
- Current Assignee: Kyodo Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Millen White Zelano and Branigan, PC
- Priority: JP2014-125032 20140618
- International Application: PCT/JP2015/067660 WO 20150618
- International Announcement: WO2015/194646 WO 20151223
- Main IPC: A61J1/03
- IPC: A61J1/03 ; B65D81/26 ; B32B27/32 ; B32B15/20 ; B32B15/085 ; B32B27/08
Abstract:
The purpose of the present invention is to provide an absorbent layer for blister packs, which imparts sufficient formability and is free from forming failure even if a pocket part is formed to a certain depth. An absorbent layer for blister packs, which sequentially comprises, in the following order, an outer skin layer, an intermediate layer containing an inorganic absorbent and a binder resin, and an inner skin layer containing 5-80% by mass of a metallocene polypropylene and 95-20% by mass of a non-metallocene polypropylene.
Public/Granted literature
- US20170319433A1 ABSORBING LAYER FOR BLISTER PACKAGE, LAMINATE COMPRISING SAME, AND BLISTER PACKAGE USING SAID LAMINATE Public/Granted day:2017-11-09
Information query
