Invention Grant
- Patent Title: Cutting die
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Application No.: US15300080Application Date: 2015-03-19
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Publication No.: US10010924B2Publication Date: 2018-07-03
- Inventor: Hideyuki Moriya , Shigeru Endo
- Applicant: AMADA HOLDINGS CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-075912 20140402; JP2015-044670 20150306
- International Application: PCT/JP2015/058204 WO 20150319
- International Announcement: WO2015/151829 WO 20151008
- Main IPC: B23P23/02
- IPC: B23P23/02 ; B23D1/26 ; B23D11/00 ; B21D28/14 ; B21D45/02 ; B23Q11/00 ; B23D13/04

Abstract:
In a cutting die having a cutting chip, applied to a punch press, and cutting a work in collaboration with a cutting punch, a resistance member for guiding swarf generated during cutting of the work through the cutting chip and dividing it by giving resistance to it is provided around a scrap discharge hole so that the divided swarf does not remain in the scrap discharge hole but is discharged to an outside so as to prevent clogging by scrap.
Public/Granted literature
- US20170136518A1 CUTTING DIE Public/Granted day:2017-05-18
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