Invention Grant
- Patent Title: Systems and methods for forming apertures in microfeature workpieces
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Application No.: US15276627Application Date: 2016-09-26
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Publication No.: US10010977B2Publication Date: 2018-07-03
- Inventor: Charles M. Watkins , William M. Hiatt
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: B23K26/382
- IPC: B23K26/382 ; B23K26/03 ; B23K26/362 ; H01L21/768 ; H05K3/00 ; H01L21/48 ; B23K26/38 ; B23K26/40 ; B23K26/361 ; B23K103/00 ; B23K101/40

Abstract:
Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.
Public/Granted literature
- US20170008129A1 SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES Public/Granted day:2017-01-12
Information query
IPC分类: