Invention Grant
- Patent Title: Valve seat machining device, and valve seat machining method using said valve seat machining device
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Application No.: US15325259Application Date: 2016-06-15
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Publication No.: US10010995B2Publication Date: 2018-07-03
- Inventor: Daichi Sugitani
- Applicant: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
- Applicant Address: JP Kanagawa
- Assignee: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
- Current Assignee: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2015-120764 20150616
- International Application: PCT/JP2016/067722 WO 20160615
- International Announcement: WO2016/204157 WO 20161222
- Main IPC: B23B41/12
- IPC: B23B41/12 ; B23Q9/00 ; B24B15/04 ; F01D17/14 ; F16K1/42 ; B24B15/03

Abstract:
A valve seat processing machine (1) configured to process a valve seat (118) in a valve device (101) including a valve body portion (110) which forms a flow passage of fluid and a valve drive portion (120) which drives a valve element (124) capable of tightly engaging with the valve seat (118) in the valve body portion (110) includes: a base portion (10) attached to the valve body portion (110); a main body portion (20) movable relative to the base portion (10) in two different axial directions; a support portion (30) movable relative to the main body portion (20) in a drive direction of the valve element (124); a main spindle (40) rotatable relative to the support portion (30) about an axis parallel to the drive direction of the valve element (124); and a tool holder (50) configured to hold a tool (T) for processing the valve seat (118).
Public/Granted literature
- US20170182623A1 VALVE SEAT MACHINING DEVICE, AND VALVE SEAT MACHINING METHOD USING SAID VALVE SEAT MACHINING DEVICE Public/Granted day:2017-06-29
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