Invention Grant
- Patent Title: Bonding structure of aluminum member and copper member
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Application No.: US14428776Application Date: 2013-09-18
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Publication No.: US10011093B2Publication Date: 2018-07-03
- Inventor: Nobuyuki Terasaki , Yoshiyuki Nagatomo
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2012-208578 20120921
- International Application: PCT/JP2013/075158 WO 20130918
- International Announcement: WO2014/046130 WO 20140327
- Main IPC: B32B15/01
- IPC: B32B15/01 ; B23K20/02 ; B23K20/233 ; H01L23/36 ; B23K101/36 ; B23K103/10 ; B23K103/12 ; H01L23/433
Abstract:
A bonding structure of an aluminum member and a copper member includes: the aluminum member composed of aluminum or an aluminum alloy, and the copper member composed of copper or a copper alloy in which the aluminum member and the copper member are bonded together by solid phase diffusion bonding; an intermetallic compound layer that is made of copper and aluminum and is formed in a bonding interface between the aluminum member and the copper member; and an oxide dispersed in an interface between the copper member and the intermetallic compound layer in a layered form along the interface.
Public/Granted literature
- US20150251382A1 BONDING STRUCTURE OF ALUMINUM MEMBER AND COPPER MEMBER Public/Granted day:2015-09-10
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