Invention Grant
- Patent Title: Polyamide resin composition and method for enhancing thermal aging resistance of polyamide resin
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Application No.: US15312224Application Date: 2015-05-20
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Publication No.: US10011700B2Publication Date: 2018-07-03
- Inventor: Nobuhiro Yoshimura
- Applicant: TOYOBO CO., LTD.
- Applicant Address: JP Osaka
- Assignee: TOYOBO CO., LTD.
- Current Assignee: TOYOBO CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2014-105336 20140521; JP2014-176985 20140901
- International Application: PCT/JP2015/064459 WO 20150520
- International Announcement: WO2015/178417 WO 20151126
- Main IPC: C08K3/28
- IPC: C08K3/28 ; C08K3/16 ; C08L77/06 ; C08J3/20 ; C08G69/36

Abstract:
The present invention is a polyamide resin composition having excellent thermal aging resistance and excellent mechanical characteristics, and containing 0.5 to 20 part(s) by mass of a metal cyanide salt having the general composition formula (Ax[M(CN)y]) to 100 parts by mass of a polyamide resin. In the general composition formula, M is at least one member of transition metal elements in groups 5 to 10 and periods 4 to 6 of a periodic table; A is at least one member of alkali metal and alkaline earth metal; y is an integer of from 3 to 6; and x is a number calculated by (y−m)/a, wherein m is a valence of M and a is a valence of A.
Public/Granted literature
- US20170081498A1 POLYAMIDE RESIN COMPOSITION AND METHOD FOR ENHANCING THERMAL AGING RESISTANCE OF POLYAMIDE RESIN Public/Granted day:2017-03-23
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