An epoxy or hardener mixture comprising (a) optionally water, (b) at least one hardener or epoxy resin, and (c) from 0.1 to 20 weight percent, based on epoxy resin of at least one distyryl phenol, tristyryl phenol or cumylphenol based additive surfactant with phosphate or sulfonate end groups having the structure R—OXn-W wherein R designates a polystyrylphenol or cumylphenol, preferentially chosen from among distyrylphenol, tristyrylphenol or cumylphenol, and mixtures thereof, and wherein OX designates ethylene oxide and/or propylene oxide. The number of groups “n” varies from 0 to 200, and W designates H, sulfate (—SO3−) or phosphate (—PO3H or —PO2—OXnR). Freeze thaw resistance and improved stability is obtained in epoxy mixtures used in dispersion form. Improved pot life and cure time is obtained using either the epoxy mixture, the hardener mixture or a combination of the two in epoxy hardener formulations.