Invention Grant
- Patent Title: Copper electrodeposition bath containing an electrochemically inert cation
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Application No.: US14482617Application Date: 2014-09-10
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Publication No.: US10011914B2Publication Date: 2018-07-03
- Inventor: Laurianne Religieux , Paul Blondeau , Dominique Suhr
- Applicant: ALCHIMER
- Applicant Address: FR Massy
- Assignee: ALCHIMER
- Current Assignee: ALCHIMER
- Current Assignee Address: FR Massy
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D7/12 ; H01L21/288 ; H01L21/768
Abstract:
The present invention relates to an electrolyte composition for depositing copper on metal substrates. The composition contains a combination of two aromatic amines and an electrochemically inert cation. This electrolyte makes it possible to increase the copper nucleation density. It also allows bottom-up filling in trenches that have a very small opening dimension, typically lower than 40 nm.
Public/Granted literature
- US20150159291A1 COPPER ELECTRODEPOSITION BATH CONTAINING AN ELECTROCHEMICALLY INERT CATION Public/Granted day:2015-06-11
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