Invention Grant
- Patent Title: Apparatus and process of electro-chemical plating
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Application No.: US14581876Application Date: 2014-12-23
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Publication No.: US10011918B2Publication Date: 2018-07-03
- Inventor: Ying-Hsueh Changchien , Yu-Ming Lee , Chi-Ming Yang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: C25D5/00
- IPC: C25D5/00 ; C25D3/02 ; C25D21/06 ; C25D21/02 ; C25D21/18
Abstract:
An electro-chemical plating process begins with supplying a supercritical fluid into an electroplating solution to be deposited, and a bias is applied between a substrate and an electrode, which is located in the electroplating solution. The substrate is placed into the electroplating solution to deposit a material on the substrate.
Public/Granted literature
- US20160177467A1 APPARATUS AND PROCESS OF ELECTRO-CHEMICAL PLATING Public/Granted day:2016-06-23
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