Invention Grant
- Patent Title: Hinge arrangement with sag compensation
-
Application No.: US15066530Application Date: 2016-03-10
-
Publication No.: US10012014B2Publication Date: 2018-07-03
- Inventor: Dale G. Malott , Gary E. Will , Benjamin M. Sandoval
- Applicant: THE HILLMAN GROUP, INC.
- Applicant Address: US OH Cincinnati
- Assignee: THE HILLMAN GROUP, INC.
- Current Assignee: THE HILLMAN GROUP, INC.
- Current Assignee Address: US OH Cincinnati
- Agency: Thompson Hine LLP
- Main IPC: E05D7/04
- IPC: E05D7/04 ; E05D5/04 ; E05D11/10 ; E05F1/06 ; E05F1/12 ; E05D3/02

Abstract:
A hinge arrangement includes a first hinge plate assembly including a pivot housing movable about a pivot axis and including a threaded adjustment pin transverse to the pivot axis away from the housing. A second hinge plate assembly includes an adjustment housing, the adjustment housing including a threaded portion. The threaded adjustment pin is threaded into the adjustment housing to connect the first hinge plate assembly to the second hinge plate assembly. Relative rotation between the threaded adjustment pin and the threaded portion of the adjustment housing causes the second hinge plate assembly to move along a length of the threaded adjustment pin, altering a spacing between a mount plate portion of the first hinge plate assembly and a mount plate portion of the second hinge plate assembly. A connection between the pivot housing and the first hinge plate assembly may include a torsional and/or gravity closing bias.
Public/Granted literature
- US20160273251A1 HINGE ARRANGEMENT WITH SAG COMPENSATION Public/Granted day:2016-09-22
Information query