Invention Grant
- Patent Title: Method of extracting capacitances of arbitrarily oriented 3D interconnects
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Application No.: US15162254Application Date: 2016-05-23
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Publication No.: US10013522B2Publication Date: 2018-07-03
- Inventor: Marios Visvardis , Stefanos Stefanou , Errikos Lourandakis
- Applicant: Helic, Inc.
- Applicant Address: US CA San Jose
- Assignee: Helic, Inc.
- Current Assignee: Helic, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Shami Messinger PLLC
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
An apparatus for extracting capacitances of arbitrarily oriented three-dimensional interconnects includes a processor configured to recursively execute a floating random walk algorithm over a plurality of points for a plurality of conductors, to permit determination of a potential at a plurality of points on a Gaussian surface around each conductor and determination of a coupling capacitance between each conductor. Each iteration includes selecting an initial domain centered about an initial boundary point on a Gaussian surface of an initial conductor, determining a new boundary point on the initial domain from which a successive domain centered about the new boundary point may be selected, and determining a corresponding successive boundary point on the successive domain, each iteration continuing until the new boundary point or the corresponding successive boundary point terminates on a boundary having a known potential. Each selected domain may be rotated to align with the nearest conductor.
Public/Granted literature
- US20160342729A1 METHOD OF EXTRACTING CAPACITANCES OF ARBITRARILY ORIENTED 3D INTERCONNECTS Public/Granted day:2016-11-24
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