An apparatus according to one embodiment includes a substrate having a media bearing surface, and a first shield above the substrate. The first shield has a media facing side recessed from a plane extending along the media bearing surface of the substrate. A current-perpendicular-to-plane sensor is located above the substrate, the sensor having a media facing side recessed from the plane extending along the media bearing surface of the substrate. An electrically nonconductive first film is positioned on the media facing sides of the first shield and sensor. A second film is positioned on a media facing side of the first film, the second film comprising a refractory metal.