Invention Grant
- Patent Title: Semiconductor memory package including memory device with inverting circuit
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Application No.: US15490614Application Date: 2017-04-18
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Publication No.: US10014037B2Publication Date: 2018-07-03
- Inventor: Kyo-min Sohn
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2012-0020397 20120228
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C7/10 ; G11C5/02 ; G11C5/06 ; G11C7/22 ; G11C7/12

Abstract:
A semiconductor memory device includes a plurality of memory banks in a first region, a data terminal to which an input data signal is input, the data terminal being in a second region, and an inverting circuit that inverts or non-inverts the input data signal in response to an inversion control signal indicating whether the input data signal has been inverted, wherein at least one inverting circuit is disposed for each of the plurality of memory banks.
Public/Granted literature
- US20170221534A1 SEMICONDUCTOR MEMORY PACKAGE Public/Granted day:2017-08-03
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