Invention Grant
- Patent Title: Substrate terminal mounted electronic element
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Application No.: US14661018Application Date: 2015-03-18
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Publication No.: US10014111B2Publication Date: 2018-07-03
- Inventor: Kazuo Hattori , Isamu Fujimoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-059985 20140324
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/228 ; H01C1/14 ; H01C7/18 ; H01G2/06 ; H01G4/12 ; H01G4/232 ; H05K1/14 ; H01F27/29 ; H05K1/18 ; H05K1/11 ; H05K3/00

Abstract:
An electronic component includes an electronic element including external electrodes on a surface and a substrate terminal on which the electronic element is mounted. The substrate terminal includes a first main surface, a second main surface opposite the first main surface, and a peripheral surface joining the first main surface and the second main surface. The substrate terminal includes mounting electrodes provided on the second main surface and electrically connected to the external electrodes of the electronic element, and connection electrodes provided on the first main surface and electrically connected to lands of a circuit substrate. A maximum width of the connection electrodes is greater than a maximum width of the mounting electrodes.
Public/Granted literature
- US20150270068A1 ELECTRONIC COMPONENT Public/Granted day:2015-09-24
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