Invention Grant
- Patent Title: Tungsten gate and method for forming
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Application No.: US15681654Application Date: 2017-08-21
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Publication No.: US10014180B1Publication Date: 2018-07-03
- Inventor: Neal A. Makela , Vimal K. Kamineni , Pei Liu , Chih-Chiang Chang
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Francois Pagette
- Main IPC: H01L21/285
- IPC: H01L21/285 ; H01L21/02 ; H01L21/3105 ; H01L29/423

Abstract:
A structure and method for forming a tungsten region for a replacement metal gate (RMG). The method for forming the tungsten region may include, among other things, forming a first tungsten region i.e., tungsten seed layer, on a liner in a trench of a dielectric layer; removing a portion of the liner and the tungsten seed layer to expose an uppermost surface of a work function metal (WFM) layer wherein an uppermost surface of the liner and tungsten seed layer is positioned below an uppermost surface of the dielectric layer; and forming a second tungsten region from the tungsten seed layer. The tungsten region may be formed to contact the uppermost surface liner, the uppermost surface of WFM layer, and/or the sidewalls of the trench. The tungsten region may include a single crystallographic orientation. The tungsten region may also include an uppermost surface with a substantially arcuate cross-sectional geometry.
Information query
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