Invention Grant
- Patent Title: Method for realizing ultra-thin sensors and electronics with enhanced fragility
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Application No.: US15207185Application Date: 2016-07-11
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Publication No.: US10014204B2Publication Date: 2018-07-03
- Inventor: Eugene H. Cook , Amy Duwel , David J. Carter , Gayatri E. Perlin
- Applicant: THE CHARLES STARK DRAPER LABORATORY, INC.
- Applicant Address: US MA Cambridge
- Assignee: THE CHARLES STARK DRAPER LABORATORY, INC.
- Current Assignee: THE CHARLES STARK DRAPER LABORATORY, INC.
- Current Assignee Address: US MA Cambridge
- Agency: Lando & Anastasi, LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/304 ; H01L21/3065 ; H01L21/78 ; H01L23/00 ; G06K19/073
Abstract:
A method of fabricating ultra-thin semiconductor devices includes forming an array of semiconductor dielets mechanically suspended on a frame with at least one tether connecting each semiconductor dielet of the array of semiconductor dielets to the frame.
Public/Granted literature
- US20180012786A1 METHOD FOR REALIZING ULTRA-THIN SENSORS AND ELECTRONICS WITH ENHANCED FRAGILILTY Public/Granted day:2018-01-11
Information query
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