Invention Grant
- Patent Title: Circuit board having a heat dissipating sheet with varying metal grain size
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Application No.: US15535122Application Date: 2015-12-14
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Publication No.: US10014237B2Publication Date: 2018-07-03
- Inventor: Shinichi Kooriyama , Narutoshi Ogawa , Masashi Konagai , Kensou Ochiai , Noritaka Niino
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2014-254180 20141216
- International Application: PCT/JP2015/084921 WO 20151214
- International Announcement: WO2016/098723 WO 20160623
- Main IPC: H01L23/15
- IPC: H01L23/15 ; H01L33/64 ; H01L51/52 ; H01L23/373 ; H01L21/48
Abstract:
A circuit board includes an insulating substrate; a metal circuit sheet joined to a first principal surface of the insulating substrate; and a heat dissipating sheet made of metal and joined to a second principal surface of the insulating substrate, the second principal surface being opposite the first principal surface. The thickness of the heat dissipating sheet is at least 3.75 times the thickness of the metal circuit sheet. The size of metal grains contained in the heat dissipating sheet is smaller than the size of metal grains contained in the metal circuit sheet, and decreases with increasing distance from the second principal surface of the insulating substrate.
Public/Granted literature
- US20170352607A1 CIRCUIT BOARD AND ELECTRONIC DEVICE Public/Granted day:2017-12-07
Information query
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