A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region provided on the substrate. The pad region is configured for mounting an electronic component. The pad region comprises a plurality of pads spaced from each other and traces connected to their respective pads. At least one of the traces comprises an extension which extends along a perimeter of the pad region. The present invention provides a reliable adhesion between the chip and pad region.