Invention Grant
- Patent Title: Silicon carbide semiconductor device having gate electrode
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Application No.: US15512916Application Date: 2015-08-31
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Publication No.: US10014258B2Publication Date: 2018-07-03
- Inventor: Shunsuke Yamada , So Tanaka , Daisuke Hamajima , Shinji Kimura , Masayuki Kobayashi , Masaki Kijima , Maki Hamada
- Applicant: Sumitomo Electric Industries, Ltd. , Renesas Electronics Corporation
- Applicant Address: JP Osaka-shi JP Tokyo
- Assignee: Sumitomo Electric Industries, Ltd.,Renesas Electronics Corporation
- Current Assignee: Sumitomo Electric Industries, Ltd.,Renesas Electronics Corporation
- Current Assignee Address: JP Osaka-shi JP Tokyo
- Agency: Venable LLP
- Agent Michael A. Sartori; Kerri M. Patterson
- Priority: JP2014-217534 20141024
- International Application: PCT/JP2015/074671 WO 20150831
- International Announcement: WO2016/063630 WO 20160428
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/532 ; H01L29/16 ; H01L29/78 ; H01L29/45

Abstract:
The gate electrode is provided on the gate insulating film. The interlayer insulating film is provided to cover the gate electrode. The interlayer insulating film includes a first insulating film which is in contact with the gate electrode, contains silicon atoms, and contains neither phosphorus atoms nor boron atoms, a second insulating film which is provided on the first insulating film and contains silicon atoms and at least one of phosphorus atoms and boron atoms, and a third insulating film which contains silicon atoms and contains neither phosphorus atoms nor boron atoms. The second insulating film has a first surface which is in contact with the first insulating film, a second surface opposite to the first surface, and a third surface which connects the first surface and the second surface. The third insulating film is in contact with at least one of the second surface and the third surface.
Public/Granted literature
- US20170309574A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2017-10-26
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