Invention Grant
- Patent Title: Semiconductor chip and stacked semiconductor package having the same
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Application No.: US14849302Application Date: 2015-09-09
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Publication No.: US10014278B2Publication Date: 2018-07-03
- Inventor: Ho Young Son
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2011-0140033 20111222
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00 ; H01L25/065 ; H01L23/532
Abstract:
A semiconductor chip includes a substrate, through-electrodes passing through the substrate, and a dielectric layer formed between the substrate and the through-electrodes and having a dielectric constant decreasing structure.
Public/Granted literature
- US20180040588A9 SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME Public/Granted day:2018-02-08
Information query
IPC分类:
