Invention Grant
- Patent Title: Three dimensional fully molded power electronics module having a plurality of spacers for high power applications
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Application No.: US15619532Application Date: 2017-06-11
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Publication No.: US10014280B2Publication Date: 2018-07-03
- Inventor: Ziyang Gao , Xunqing Shi , Shi Wo Chow
- Applicant: Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Applicant Address: CN Hong Kong
- Assignee: HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE CO. LTD.
- Current Assignee: HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE CO. LTD.
- Current Assignee Address: CN Hong Kong
- Agency: Eagle IP Limited
- Agent Jacqueline C. Lui
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H05K7/10 ; H01L21/00 ; H01L25/065 ; H01L21/56 ; H01L21/48 ; H01L23/31 ; H01L23/498 ; H01L25/00 ; H01L23/00 ; H01L25/10
Abstract:
A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.
Public/Granted literature
Information query
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