Invention Grant
- Patent Title: High heat dissipation stacked chip package structure and the manufacture method thereof
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Application No.: US15782239Application Date: 2017-10-12
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Publication No.: US10014283B1Publication Date: 2018-07-03
- Inventor: Chin-Liang Chiang , Neng-Huang Chu , Yi-Lun Wu
- Applicant: Jing Qiao Corporation Limited
- Applicant Address: TW Zhubei, Hsinchu County
- Assignee: Jing Qiao Corporation Limited
- Current Assignee: Jing Qiao Corporation Limited
- Current Assignee Address: TW Zhubei, Hsinchu County
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW106127149A 20170810
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/367 ; H01L21/48 ; H01L21/52 ; H01L21/56 ; H01L23/495 ; H01L23/522 ; H01L23/15 ; H01L21/60 ; H01L21/603 ; H01L25/04 ; H01L25/11 ; H01L25/075
Abstract:
The present invention provides a semiconductor device including a first glass substrate, a first integrated chip, a first anisotropic conductive film, a second glass substrate, a second integrated chip, a second anisotropic conductive film, and a packaging body.
Information query
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