Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15659325Application Date: 2017-07-25
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Publication No.: US10014287B2Publication Date: 2018-07-03
- Inventor: Kazuhiro Tsumura
- Applicant: SII Semiconductor Corporation
- Applicant Address: JP
- Assignee: ABLIC Inc.
- Current Assignee: ABLIC Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2015-049780 20150312
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L23/34 ; H01L27/088 ; H01L29/78

Abstract:
A semiconductor device includes a power element and a heat sensing element configured to detect a temperature of the power element. The power element includes lateral MOS transistors having drains and gate electrodes, two of the drains being shorter in length than the remaining drains and two of the gate electrodes being shorter in length than the remaining gate electrodes. The heat sensing element has a rectangular shape and is disposed between the two shorter drains and the two shorter gate electrodes to accurately detect the temperature of the power element.
Public/Granted literature
- US20170323878A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-11-09
Information query
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