Invention Grant
- Patent Title: Semiconductor integrated circuit device and a method of manufacturing the same
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Application No.: US15677445Application Date: 2017-08-15
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Publication No.: US10014312B2Publication Date: 2018-07-03
- Inventor: Shoji Shukuri
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Gregory E. Montone
- Priority: JP2002-115924 20020418
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/11568 ; H01L29/45 ; B82Y10/00 ; G11C16/10 ; G11C16/14 ; G11C16/26 ; H01L21/28 ; H01L27/02 ; H01L27/105 ; H01L27/115 ; H01L27/11521 ; H01L27/11526 ; H01L27/11546 ; H01L27/11573 ; H01L29/792 ; H01L23/535 ; H01L27/1157 ; G11C16/04 ; H01L29/49 ; H01L29/51 ; G11C16/34 ; H01L29/66

Abstract:
A semiconductor device including a memory cell featuring a first gate insulating film over a semiconductor substrate, a control gate electrode over the first gate insulating film, a second gate insulating film over the substrate and a side wall of the control gate electrode, a memory gate electrode over the second gate insulating film arranged adjacent with the control gate electrode through the second gate insulating film, first and second semiconductor regions in the substrate positioned on a control gate electrode side and a memory gate side, respectively, the second gate insulating film featuring a first film over the substrate, a charge storage film over the first film and a third film over the second film, the first film having a first portion between the substrate and memory gate electrode and a thickness greater than that of a second portion between the control gate electrode and the memory gate electrode.
Public/Granted literature
- US20170373083A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-12-28
Information query
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