Invention Grant
- Patent Title: Local SOI fins with multiple heights
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Application No.: US15446632Application Date: 2017-03-01
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Publication No.: US10014322B2Publication Date: 2018-07-03
- Inventor: Kangguo Cheng , Joel P. de Souza , Ali Khakifirooz , Alexander Reznicek , Dominic J. Schepis
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/336 ; H01L27/12 ; H01L29/06 ; H01L29/167 ; H01L29/78 ; H01L29/36 ; H01L21/225 ; H01L21/762 ; H01L21/84

Abstract:
A semiconductor structure is provided that contains silicon fins having different heights, while maintaining a reasonable fin height to width ratio for process feasibility. The semiconductor structure includes a first silicon fin of a first height and located on a pedestal portion of a first oxide structure. The structure further includes a second silicon fin of a second height and located on a pedestal portion of a second oxide structure. The first oxide structure and the second oxide structure are interconnected and the second oxide structure has a bottommost surface that is located beneath a bottommost surface of the first oxide structure. Further, the second height of the second silicon fin is greater than the first height of the first silicon fin, yet a topmost surface of the first silicon fin is coplanar with a topmost surface of the second silicon fin.
Public/Granted literature
- US20170179163A1 LOCAL SOI FINS WITH MULTIPLE HEIGHTS Public/Granted day:2017-06-22
Information query
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