Invention Grant
- Patent Title: Method for fabricating array substrate, array substrate and display device
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Application No.: US14352581Application Date: 2013-03-25
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Publication No.: US10014326B2Publication Date: 2018-07-03
- Inventor: Xiaodan Wei , Xingqiang Zhang , Zhong Lu , Dongkoog Jang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Chengdu, Sichuan Province
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Chengdu, Sichuan Province
- Agency: Ladas & Parry LLP
- Agent Loren K. Thompson
- Priority: CN201310053700 20130219
- International Application: PCT/CN2013/073143 WO 20130325
- International Announcement: WO2014/127552 WO 20140828
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L29/10 ; H01L21/84 ; H01L27/12 ; H01L29/66 ; H01L29/786
Abstract:
A method for fabricating an array substrate, an array substrate and a display device are provided. The method for fabricating the array substrate includes: forming a spacer layer on the array substrate, the spacer layer is disposed under a planarized layer and corresponds to a location of a via hole in the planarized layer, wherein the planarized layer is formed of a hot melt material.
Public/Granted literature
- US20160079278A1 METHOD FOR FABRICATING ARRAY SUBSTRATE, ARRAY SUBSTRATE AND DISPLAY DEVICE Public/Granted day:2016-03-17
Information query
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