Invention Grant
- Patent Title: Semiconductor device, method of manufacturing semiconductor device, inverter circuit, driving device, vehicle, and elevator
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Application No.: US15430687Application Date: 2017-02-13
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Publication No.: US10014378B2Publication Date: 2018-07-03
- Inventor: Tatsuo Shimizu , Ryosuke Iijima
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2016-181948 20160916
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/40 ; H01L29/16 ; H01L29/10 ; H01L29/78 ; H01L29/66 ; H02M7/537 ; B60R16/02 ; B66B11/04 ; B61C3/00

Abstract:
A semiconductor device according to an embodiment includes a silicon carbide layer, an insulating layer, and a region provided between the silicon carbide layer and the insulating layer, the region including a plurality of first atoms of one element from the group consisting of nitrogen (N), phosphorus (P), arsenic (As), antimony (Sb), and bismuth (Si), at least some of the plurality of first atoms being four-fold coordinated atoms and/or five-fold coordinated atoms.
Public/Granted literature
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