Invention Grant
- Patent Title: Optoelectronic semiconductor chip
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Application No.: US14905763Application Date: 2014-06-25
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Publication No.: US10014444B2Publication Date: 2018-07-03
- Inventor: Karl Engl , Georg Hartung , Johann Eibl , Michael Huber , Markus Maute
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102013107531 20130716
- International Application: PCT/EP2014/063423 WO 20140625
- International Announcement: WO2015/007486 WO 20150122
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/46 ; H01L33/44 ; H01L33/50 ; H01L33/62 ; H01L33/22 ; H01L33/38 ; H01L33/40
Abstract:
An optoelectronic semi-conductor chip is disclosed in which an encapsulation layer, which is an ALD layer, completely covers a first mirror layer on the side thereof facing away from a p-conductive region, and is arranged to be in direct contact with said first mirror layer in some sections.
Public/Granted literature
- US20160172545A1 Optoelectronic Semiconductor Chip Public/Granted day:2016-06-16
Information query
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