Invention Grant
- Patent Title: Semiconductor memory device
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Application No.: US15478309Application Date: 2017-04-04
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Publication No.: US10014467B2Publication Date: 2018-07-03
- Inventor: Daisaburo Takashima
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
According to one embodiment, a semiconductor memory device includes a plurality of first resistance-change memory elements of a two-terminal type, a second resistance-change memory element of a two-terminal type, a rectifier element of a two-terminal type, a local bit line connected to ends of the first resistance-change memory elements, an end of the second resistance-change memory element and an end of the rectifier element, and a global bit line connected to the other end of the second resistance-change memory element.
Public/Granted literature
- US20170207272A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2017-07-20
Information query
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