Invention Grant
- Patent Title: Electronic device assembly and protection member
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Application No.: US15520213Application Date: 2015-09-14
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Publication No.: US10014482B2Publication Date: 2018-07-03
- Inventor: Shota Nishi , Masato Suzuki , Makoto Noda , Takuji Matsuo , Kenichi Izumi
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2014-220275 20141029
- International Application: PCT/JP2015/075960 WO 20150914
- International Announcement: WO2016/067771 WO 20160506
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L27/32 ; B32B7/12 ; B32B15/06 ; B32B15/08

Abstract:
An electronic device assembly 10 includes: an electronic device 20 having flexibility; and a protection member 50 bonded to the electronic device 20. The protection member 50 includes a metal foil 53 that is supported by a support member 51 having flexibility and an adhesive layer 54 formed on the metal foil 53. The metal foil 53 included in the protection member 50 is bonded to the electronic device 20 via the adhesive layer 54.
Public/Granted literature
- US20170317300A1 ELECTRONIC DEVICE ASSEMBLY AND PROTECTION MEMBER Public/Granted day:2017-11-02
Information query
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