Invention Grant
- Patent Title: Conductive adhesive composition for electrochemical element electrode, collector with adhesive layer, and electrochemical element electrode
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Application No.: US14236491Application Date: 2012-08-03
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Publication No.: US10014528B2Publication Date: 2018-07-03
- Inventor: Koichiro Maeda , Naoki Yoshida
- Applicant: Koichiro Maeda , Naoki Yoshida
- Applicant Address: JP Tokyo
- Assignee: Zeon Corporation
- Current Assignee: Zeon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2011-170386 20110803
- International Application: PCT/JP2012/069833 WO 20120803
- International Announcement: WO2013/018887 WO 20130207
- Main IPC: H01G11/22
- IPC: H01G11/22 ; H01G11/66 ; H01M4/04 ; H01M4/66 ; H01M4/133

Abstract:
To provide a conductive adhesive composition for an electrochemical element electrode and used in forming a conductive adhesive layer that is highly uniform and is interposed between a collector and an electrode composition layer, being able to contribute to increased adhesion between the two. The conductive adhesive composition for an electrochemical element electrode is characterized by containing: conductive carbon; a particulate copolymer (A) containing a dibasic acid monomer unit; a particulate copolymer (B) containing an ethylenically unsaturated carboxylic acid amide derivative unit; and a dispersing agent.
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