Invention Grant
- Patent Title: Method for manufacturing wire harness
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Application No.: US14636392Application Date: 2015-03-03
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Publication No.: US10014642B2Publication Date: 2018-07-03
- Inventor: Eiichi Tohyama
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2012-192837 20120903
- Main IPC: H01R43/20
- IPC: H01R43/20 ; H01B11/18 ; H02G3/04 ; H01B13/016 ; H01R43/24 ; H01R13/622 ; H01R13/62 ; H01R13/623 ; H01B13/012 ; B60R16/02
Abstract:
In a method for manufacturing a wire harness, a process in which a metallic tube body is expanded in an exterior member to be an expanded state, so that an outer surface of an insulator comes into close contact with an inner surface of the exterior member is included.
Public/Granted literature
- US20150179311A1 Method for Manufacturing Wire Harness Public/Granted day:2015-06-25
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